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Hesse & Knipps, Inc.

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Sep 26, 2007 - New Listing
Hesse & Knipps, Inc.
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Besides Fine and Heavy Wire Bonders and Ultrasonic Flipchip-Bonders Hesse & Knipps develops and manufactures standard and custom solutions for Automation.
  • Fine Wire Wedge Bonder
  • Ribbon Bonder
  • Deep Access Bonder
  • Heavy Wire Bonder
  • Ultrasonic Flipchip-Bonder
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Marketplace Sponsors

Simplify BGA Rework with adhesive backed stencils
If you've been using metal stencils for BGA rework, we have some great news.
CircuitMedic
The next generation in soldering systems
The new MX-5000 Series Soldering and Rework System is the next generation of the trusted Metcal Soldering Systems.
OK International
Extraordinary range, ideal for high flex, high mix
The FLX2011 pick & place system: extraordinary application range, ideal for high flexible, high mix production, as a stand alone or inline machine.
Essemtec
Fast, Precise, Cost Effective Precision Coating
Ultrasonic Spray Technology delivers thin, precise coating of low viscosity materials..
Ultrasonic Systems, Inc.
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