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Sep 27, 2009 - Video Update

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Henkel's breakthrough epoxy flux material, Hysol FF6000, combines flux functionality and under-fill protection into a single material. A reflow curable material, Hysol FF6000 has been formulated to provide fluxing action for lead-free solder joint formation and, when cured, delivers under-fill like protection against mechanical stress.

The versatility of the material allows for various deposition methods including screen printing, dispensing, dipping and jetting. In addition, Hysol FF6000 delivers broad application options that offer an in-line, cost-effective alternative for such processes as ball attach, package on package assembly, flip chip device and large format BGA and CSP assembly.

About Henkel Corporation

With the industry now in full transition to lead-free manufacturing, leading electronics firms around the globe are partnering with Henkel to ensure a smooth Pb-free conversion and a long-term materials solution.

Also thermal cycling and environmental protection are tantamount in today's advanced electronics market and Henkel is committed to delivering a wide variety of material solutions that provide durability and protection.

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