Flux and under-fill in a single material

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Sep 27, 2009 - Video Update

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Flux and under-fill in a single material

Flux and under-fill in a single material
Henkel's breakthrough epoxy flux material, Hysol FF6000, combines flux functionality and under-fill protection into a single material.
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Henkel Corporation

With the industry now in full transition to lead-free manufacturing, leading electronics firms around the globe are partnering with Henkel to ensure a smooth Pb-free conversion and a long-term materials solution.

Also thermal cycling and environmental protection are tantamount in today's advanced electronics market and Henkel is committed to delivering a wide variety of material solutions that provide durability and protection.

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Videos and Tech Papers

Flux and under-fill in a single material This breakthrough epoxy flux material combines flux functionality and under-fill protection into a single material. Video
Innovative no-clean, halide-free tacky flux Multicore TFN700B is a new no-clean, halide-free tacky flux from materials innovator, Henkel. Video
Enhancing Reliability of PB-Free Solder Joints This paper reviews the physical properties of different underfills and how they affect performance through reliability testing. Tech Paper
Developing a New Lead-Free Alloy This paper discusses development of a new lead free alloy for high reliability, high temperature applications. Tech Paper

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