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Tech Notes
Tech papers include white papers and case studies with the latest technical and scientific research covering the field of electronics assembly.

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Written By:
Vern Solberg
Solberg Technology Consulting
Madison, Wisconsin

Presented at an event sponsored by IPC.

IPC

IPC Association Connecting Electronics Industries
Design for Flip-Chip and Chip-Size Technology
Design for Flip-Chip and Chip-Size Technology
This paper provides a comparison of different commonly used technologies including flip-chip, chip-size and wafer level array package methodologies detailed in a new publication, IPC-7094.
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