Finetech

Address
8380 S. Kyrene Road #110
Tempe, AZ 85284 USA

Website Links
■ Home Page
■ Rework Equipment Solutions
■ Advanced Packaging
■ Flip Chip Bonders

Marketplace Categories
■ Die & Wire Bonding
■ Flip Chip & Multichip
■ Rework & Repair

Latest Activity
Jun 9, 2009 - Video Update

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QFN rework is a rather simple process - generally small die size, minimal I/O with pitches resolvable using good optics. Why then is there so much attention paid these days to the rework process?

Simply put, it's the paste. Components come without solder and need to be printed prior to placement and reflow. Finetech has developed an innovative module integrated into the Fineplacer systems.

Once the defective package is removed, a contactless solder removal step cleans the board surface. The new component is aligned to a pre-loaded stencil in the Direct Component Print module, then placed and flipped.

Solder paste is applied and the module flipped back to reveal the pick-up side of the component. Using the reflow nozzle, the pasted device is removed from the stencil, aligned to the pads on the board and reflowed using a conventional reflow profile.

No tweezer or manual operation are needed to handle the package, the paste integrity is undisturbed, the results impressive.

About Finetech

FINETECH offers innovative, high precision equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages.

Discover the equipment manufacturer that combines superior process know-how with unrivaled application modularity.

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