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Tech papers include white papers and case studies with the latest technical and scientific research covering the field of electronics assembly.

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Written By:
David Bernard
Dage Precision Industries
Fremont, CA

Bob Willis
ASKbobwillis.com
Chelmsford, Essex
United Kingdom

Martin Morrell & Matthew Beadel
Artetch Circuits
Littlehampton, West Sussex
United Kingdom

Presented at an event sponsored by IPC.

IPC

IPC Association Connecting Electronics Industries
Analysis of Voiding Under QFN Packages
Analysis of Voiding Under QFN Packages
Paper covers results of experiments on QFN devices when the ensuing voiding level was calculated by x-ray inspection.
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