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Board Talk
At Board Talk, the Assembly Brothers cut through the marketing hype, the platitudes and incompetent un-scientific baloney with a search for the truth.
This episode features:
Phil Zarrow, ITM ConsultingPhil has been involved with hybrid and PCB assembly for more than 30 years including equipment design for pcb fab and assembly. 
Jim Hall, ITM ConsultingJim has a wealth of knowledge in soldering and thermal technology, equipment and process basics and is a pioneer in the science of reflow technology. |
Passive Component Solder Voids
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Comments and Questions S.A. you are certainly on the right track. The significance of a void is directly related to its location in the solder joint, vertical as well as horizontal. You use a 5DX, so you can determine vertical position relatively accurately and (hopefully) repeatably. If everyone had a 5DX or comparable tool, we (IPC etc) could start to define a spec based on 3-D void locations co-related to solder joint reliability data. But most assembler's don't have access to this kind of inspection tool. Enough of the industry utilizes top-down X-Ray such that most can measure horizontal area of voids within a joint. As we stated in Board Talk, we don't feel that it is a very useful spec, INemi has test data that refutes the 25% horizontal criteria. The current reality is that individual users such as yourself, will have to struggle with the tools you have available and establish your own co-relations between measured void data and the reliability requirements of your products, leading to in-house acceptance criteria. Thank you for your feedback and sharing your experience. James Hall, ITM Consulting This was very interesting to me due to the fact that some have been saying with Rev. D of the 610 that voiding is just a process indicator. I have never agreed with that because I knew that a void was missing solder and would weaken the solder joint. I program an Agilent 5DX. My major concern are voids in the heels of FPGs. When I teach operators I say that I would personally fix any void larger that 25% in the heel, but they should follow the direction of their Quality Engineer. I looked at a 610 version from Feb 2005 section 5.2.2 and it did mention voids being a defect if the joint would not meet the solder specs. I would not have found it except for your article. Our solder criteria references ANSI/J-STD-001D. Most voiding topics deal with BGAs. I did some internet research before our adoption if the version D and the industry appeared to be divided down the middle as far as voiding goes. Thanks S. A. |
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