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Tech Notes
Tech papers include white papers and case studies with the latest technical and scientific research covering the field of electronics assembly.

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Written By:
Gerjan Diepstraten
Dr. Di Wu
Cobar Europe B.V.
Breda, The Netherlands

Presented at an event sponsored by IPC.

IPC

IPC Association Connecting Electronics Industries
Estimating Stencil Life
Estimating Stencil Life
This paper discusses the technique used to predict how long solder paste can be left on the stencil before it dries out and is no longer suitable for further use.
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