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Tech Notes
Tech papers include white papers and case studies with the latest technical and scientific research covering the field of electronics assembly.

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Written By:
L. G. Pymento
W.T. Davis
IBM

Ben Kim
Surangkana Umpo
Celestica

Presented at an event sponsored by IPC.

IPC

IPC Association Connecting Electronics Industries
Lead Free Development in Server Applications
Lead Free Development in Server Applications
This paper examines the effects of varying surface finishes, temperature sensitive component limitations, process parameters and the resulting interactions that affect solder attach attributes.
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