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Board Talk
At Board Talk, the Assembly Brothers cut through the marketing hype, the platitudes and incompetent un-scientific baloney with a search for the truth.
This episode features:

Phil Zarrow Phil Zarrow, ITM Consulting
Phil has been involved with hybrid and PCB assembly for more than 30 years including equipment design for pcb fab and assembly.

Jim Hall Jim Hall, ITM Consulting
Jim has a wealth of knowledge in soldering and thermal technology, equipment and process basics and is a pioneer in the science of reflow technology.
How To Determine Stencil Thickness
How To Determine Stencil Thickness
On what basis is stencil thickness decided in the case of BGA's or fine pitch components?  (Time 5:47)



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Comments and Questions
We have converted IPC 7525 for stencil thickness determination into a regression equation. Stencil Thickness = 2.64 + 0.0831 * pitch of component. Take average of all stencil thickness derived for all components, if min. to max. difference is more than 2mil, consider a step-up/step-down stencil in selective locations.

S.S.

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