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Board Talk

At Board Talk, the Assembly Brothers cut through the marketing hype, the platitudes and incompetent un-scientific baloney with a search for the truth.

Board Talk Hosts:

Phil Zarrow Phil Zarrow, ITM Consulting
Phil has been involved with hybrid and PCB assembly for more than 30 years including equipment design for pcb fab and assembly.

Jim Hall Jim Hall, ITM Consulting
Jim has a wealth of knowledge in soldering and thermal technology, equipment and process basics and is a pioneer in the science of reflow technology.
Now Playing

Coping in a Lead Free World
Today's topic of discussion is orientated to you poor, lost souls who are the exemptees for lead-free and have to cope with a lead-free world.  (Time 4:26)
What Is Causing Blow Holes?
What could be causing blow holes on clinched radial lead components? The Assembly Brothers discuss this odd condition.  (Time 4:51)
Concerns Regarding Counterfeit Components
We are learning about the infiltration of counterfeit components. How big is this problem, and how concerned should we be?  (Time 6:38)
Do We Still Need SMT Adhesives?
If double sided surface mount assemblies are the way of the future, should we anticipate a growing or declining need for SMT adhesives?  (Time 6:13)
Tin Lead Reflowed at Lead Free Temps
We reflowed a batch of tin-lead circuit boards with a lead-free profile at higher temperatures than specified. Would you scrap these board assemblies?  (Time 4:13)

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Index

Coping in a Lead Free World
What Is Causing Blow Holes?
Concerns Regarding Counterfeit Components
Do We Still Need SMT Adhesives?
Tin Lead Reflowed at Lead Free Temps
Can You Mix Leaded and Lead Free?
Is There A Thermal Cycle Limit?
Rosin Flux or Water Soluble - Which To Use?
Accuracy of Pick & Place System Ratings
Cleaning Solder Paste Misprint
Cause of Defective Solder Joints
Tin Whiskers on Component Leads
Screen Print Stepped Stencil Review
Are Gloves Required for PCB Handling?
De-paneling PCBs by Hand?
What Causes Exploding Solder Joints?
Lifted Leads on QFP Components
Contamination from an Aluminum Flux Tank
Can a Wave Solder Air Knife Cause Defects?
Thermocouple Attachment Review
Switching from Type 3 to Type 4 Solder Paste
Can Water Harm Electronic Components?
Standards Governing Polarity Marks
Staging Time Between Soldering and Cleaning
Proper Storage Condition For PCBs
Can Ultrasonic Cleaning Cause Damage?
How To Inspect QFN Components?
Squeegee and Stencil Life
Max Idle Time After Print, Before Reflow
Passive Component Solder Voids
Components Near PCB Edges
Rework Lead-Free Boards with Leaded Solder
Problems with Reflow Oven Profiles?
How To Calculate Component Standoff Height
Mixing Tin-lead and Lead-free
Do Vacuum Packed PCBs Need Baking?
Acceptable Level of Exposed Copper?
Components Lifting During Wave Soldering
Leaded Parts Through a Lead Free Wave
Solder Defects and Continuous Improvement
Conductive Epoxy: Pros and Cons
Through Hole Reflow - Pin in Paste
Will High Humidity Affect Reflow Soldering
Can We Skip Cleaning After Rework?
Slope Calculation for Reflow Oven Profiles
How To Determine Stencil Thickness
Solderability Problems at Low Humidity
Cleaning No Clean Boards With IPA
IR or Vapor Phase for Prototypes
Pick and Place to Insert Radial Lead Devices
Mixed Cleaning - No Clean and Water Soluble
Lead Free Solder Contamination Concern
Can Conductive Epoxies Replace Solder?
Stencil Thickness For Mixed Density Boards
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