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The Ask the Experts Panel share experiences, theories and practices to help solve problems associated with advanced electronics manufacturing and assembly.

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Ask the Experts Panel
Steven Adamson
Market Manager
Nordson Asymtek
Gregory Arslanian
Global Segment Manager
Air Products and Chemicals, Inc.
Clive Ashmore
Global Process Manager
Dek Printing Machine
Paul Austen
Senior Project Engineer
Electronic Controls Design Inc
Jess Baker
President
RPS Automation
Charlie Barnhart
Co-founder and Principal
Charlie Barnhart & Associates
Brian Bauer
Business Manager
Heraeus Incorporated
Dr. David Bernard
Product Manager
Dage Precision Industries
Hartmut Berndt
President
B.E.STAT group
Peter Biocca
Senior Market Development Engineer
Kester
Mike Bixenman
CTO
Kyzen Corp.
Bob Black
President and CEO
Juki Corporation
Ken Bliss
President & CEO
Bliss Industries, Inc.
David Bonito
Sales & Marketing Manager
Technical Manufacturing Corporation
Gary Bowman

Krayden, Inc.
Jade Bridges
R&D Manager
Electrolube Ltd
Joseph S. Bubel
President
Hesse & Knipps, Inc.
Richard Burke
National Sales Manager
Datapaq
Sam Burton
President
Tropical PCB Design Services Inc.
Alan Cable
President
ACE Production Technologies
Al Cabral
Product Development Manager
VJ Technologies, Inc.
Chuck Cimalore
CTO
Omnify Software
Bill Coleman
Vice President Technology
Photo Stencil
David Cotton
Director
Metro Technologies
Jack Crawford
Director - Certification & Assembly Technology
IPC
Robert Culpepper
Sr. Manufacturing Engineer
TransCore Amtech Technology Center
Mark J. Curtin
President
Transition Automation, Inc.
Bjorn Dahle
President
KIC
Mitch DeCaire
Sales Manager (Americas)
Cogiscan, Inc.
Steve DeCollibus
Managing Editor
Circuitnet
Giancarlo De La Garza
Sales
Nordson YESTech
Robert Dervaes
V.P. Technology & Engineering
Fine Line Stencil, Inc.
Fred Dimock
Manager, Process Technology
BTU International
Doug Dixon
Electronics Global Marketing Manager
Henkel Corp
Kent Dixon
VP Sales - Americas
Cencorp
Allen W. Duck
CEO
ATEK llc
Stuart Erickson
President
Ultrasonic Systems, Inc.
Doug Farlow
President
Production Solutions, Inc.
Daniel (Baer) Feinberg
Vice President
Fein-Line Associates
Jeff Ferry
President
Circuit Technology Center, Inc.
Tom Forsythe
Vice President
Kyzen Corporation
Jeff Fouche
Design Engineer
ACE Production Technologies
Robert Freid
President and Founder
Contract Manufacturing Consultants, Inc.
Marcel Freiermuth
Manager Solutions
Essemtec AG
Corey Fugere
Sales Manager
DL Technology
Roger Gibbs
Managing Director
PDR
Gary Goldberg
President and CEO
PROMATION, Inc.
Peter Greenland
VP Sales & Marketing
Pycon Inc.
Steve Hall
President
EKRA America
Jim Hall

ITM Consulting
James L. Harris
VP Programs/Sec/Treas
Nextek, Inc.
Richard Heimsch
Director
Protean Marketing
Stephanie Henninger
Director
Integrated Ideas & Technologies, Inc.
Drew Hession-Kunz
Business Development
Innov-X Systems
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Jennie Hwang
President
H-Technologies Group
Harold Hyman
Consultant
VJ Electronix
Terry Jeglum
President/CEO
Electronic Technology Corporation
Tim Jensen
Product Manager, Advanced Assembly Materials
Indium Corp.
Harry Jin
Product Manager
CheckSum LLC
Mike Jones
Vice President
Micro Care
Andrew Joos
VP of Business Development
X-Line Asset Management
Prashant Joshi
Director of Engineering
Interconnect Systems Inc.
Joe Karcewski
Product Manager
APS-Novastar, LLC
Tim Kardish
CEO
APS Novastar
Michael Kennedy
Marketing Director
Practical Components
Bryan Kerr
Principal Engineer - CMA Lab
BAE Systems
Phil Kinner
Business Director
HumiSeal / Chase Electronic Coatings
Kenneth Kirby
Applications Engineer
Speedline Technologies
Michael Kirschner
President
Design Chain Associates, LLC
Paul J. Koep
Global Product Manager
Cookson Electronics
Mike Konrad
President
Aqueous Technologies
Todd La Marche
Director
Image Processing Solutions, Inc.
Leo Lambert
Vice President, Technical Director
EPTAC Corporation
Charles S. Leech Jr.
Director of Engineering
Innovative Drying Co.
Glen Leinbach
President
Caber Contacts, LLC
Simon Leow
General Manager
Icon Technology
Letters from Experts Responses

Circuitnet
Richard Lieske
Product Development Engineer
DEK
EH Lim
Managing Director, Asia Pacific
ECD
Pamela Lipson
CEO & Board of Scientific Advisers
Imagen & Landrex Technologies
James Mahoney
Applications Project Manager
Quick Turn Flex Circuits LLC
Ted Marek
President
SMT Sales Associates Inc
Mark McMeen
VP Engineering Services
STI Electronics Inc.
Rodney Miller
VP of Manufacturing
Tri-onics Inc
Dr. Rita Mohanty
Director Advanced Development
Speedline Technologies
François Monette
VP Sales & Marketing
Cogiscan
Todd Moutafian
Partner
X-Line Asset Management
Terry Munson
President/Senior Technical Consultant
Foresite
Don Naugler
General Manager
VJ Technologies, Inc.
Simon G. Norman
International Director
EVS International
John Norton
Eastern Manager
Vitronics Soltec
Neil O'Brien
Sales Director
Finetech
Arnold Offner
Industry Standard Manager
Phoenix Contact
Michelle Ogihara
Sales and Marketing Manager
Seika Machinery Inc.
Michael O'Hanlon
Applications Supervisor
DEK
Brian O'Leary
Sales Manager
KIC
Todd O'Neil
Sales Manager, Soldering products
JUKI Automation Sys.
Claudio Orefice
President
High-Tech Conversions Inc.
Christian Ott
Sales Manager
Seho
Chris Palin
European Manager
HumiSeal
Mel Parrish
Director Training Materials
STI Electronics Inc.
Jean-Marc Peallat
Products & Applications Manager
Vi Technology
Jerry Pearl
Applcations Engineering Manager
Technology Information Corporation
Marc Peo
President
Heller Industries Inc.
Christopher Perry
Worldwide Sales & Marketing Manager
EMC Global Technologies, Inc.
Grant Peterson
Vice President; Marketing & Sales
ECD
Steve Pollock
Vice President
Essemtec USA
Neil Poole
Senior Applications Chemist
Henkel Corporation
Michael Ray
President
Integrated Ideas & Technologies, Inc.
Kris Roberson
Senior Technical Instructor
BEST, Inc.
Bill Schreiber
President
Smart Sonic Corporation
Mike Scimeca
President
FCT Assembly
Karl Seelig
Vice President of Technology
AIM
Larry Sirois
Applications Engineer
Ultrasonics Systems Inc.
Michael Sivigny
General Manager
CeTaQ Americas
Brian Smith
Director of Marketing and Product Technology
Kester
Mark Stansfield
Managing Director
SolderStar Ltd.
David Suihkonen
President
R&D Technical Services Inc.
Scott D. Szymanski
Global Marketing Manager
March Plasma Systems
Sandip Thakor
Quality Engineer
Matrix Telecom Solution P Ltd
Michael Todd
Technical Director
Henkel Electronics
Dr. Brian Toleno
Application Engineering
Henkel Technologies
Umut Tosun
Application Technology Manager
Zestron America
Louis Y. Ungar
President
A.T.E. Solutions, Inc.
Peter Vigneau
General Manager
Circuit Technolgy Center, Inc.
Karthik Vijayamadhavan
Area Manager - West Coast
Indium Corp.
John Vivari
Application Engineering Supervisor
Nordson EFD
Dr. Harald Wack
Executive Vice President and CEO
Zestron America
Wayne Wagner
President
Krayden Inc.
John S. Wasyliw
VP of Engineering
APS Novastar LLC
Mark Waterman
Engineer / Trainer
Electronic Controls Design, Inc. (ECD)
Markus Wilkens
President
ASYS Inc.
Jim Williams
VP, CTO
Polyonics, Inc.
Scott Wischoffer
Marketing Manager
Fuji America Corporation
Ram Wissel
Engineering Services Manager
Kyzen Corporation
Greg York
Technical Sales Manager
BLT Circuit Services Ltd
Edward Zamborsky
Regional Sales Manager
OK International Inc.
Phil Zarrow
Principal Consultant
ITM Consulting
Yun Zhang
R&D Director
Cookson Electronics, Enthone
Steven Zweig
Vice President, Sales USA
Glenbrook Technologies
Now Playing

Does Lead Free Flux Make a Difference?
Does using a lead free solder flux really make a difference? Why not use the same flux we use for leaded soldering in our lead free process?  (Time 0:28)
Recommended Lead to Hole Ratio
What is the proper minimum gap between a round conductor lead and a PCB hole that will allow for a proper solder fill?  (Time 0:19)
Wave Solder Process Issue
We are seeing deformed, unwetted solder joints after moving past the wave solder air knife. What could be causing this?  (Time 0:25)
Reflow Oven Testing and Calibrating
Is there a standard test board with specific pad and test point sizes we should use to test and calibrate our reflow ovens?  (Time 0:24)
Cause of Voids in Leadless Packages
What is the primary cause of solder voiding in leadless packages such as BGA's?  (Time 0:23)

< < < <    Page 1 of 9   > > > >

Index

Does Lead Free Flux Make a Difference?
Recommended Lead to Hole Ratio
Wave Solder Process Issue
Reflow Oven Testing and Calibrating
Cause of Voids in Leadless Packages
Cleaning Misprinted Circuit Boards
Isopropyl Alcohol Cleaning Precautions
What Is the Ideal Humidity for PCB Assembly?
Cleaning No-clean Flux with Tap Water  
Cause of Blow Holes During Wave Soldering
Solder Joint Void Limit for BGA Components
IPA To Clean Lead-Free
Is PCB Baking Necessary?
Is There a Component Rework Limit?
Idle Time Between Soldering and Cleaning
Reflow Solder Process Issue
Is Pre-Bake Standard for Rework?
DI Water Conductivity For Ultrasonic Cleaning
Recommended Rework Dwell Times
Hand Soldering vs. Selective Wave
Conformal Coating & Connector Holes
Pin-In-Paste Hole Fill
How to Clamp Odd Shaped Circuit Boards
Conformal Coating & Humidity
Ultrasonic Cleaning Causing Damage
Problem With No Clean Solder Flux Residue
Alternatives to Conformal Coating
Type III vs. Type IV Solder Paste
How to Re-Certify a Relow Oven After Moving
Component Damage From IR Reflow
Shiny or Matte Solder Resist?
BGA Replacement Limit
Socket Rework Challenge
Set Up For Lead-Free Wave Soldering
What Causes Oxidation on SMT Pads?
Which Term To Use - PWB or PCB?
Is Pre-Bake Required Prior to Rework?
Hand Soldering vs. Selective Wave
Questions About Soldering To Flex Circuits
Cause of Open BGA Solder Joints?
Technology to Measure Oxidation Levels
Nickel Barrier Thickness Requirement
Proper DI Water Resistivity for PCB Cleaning?
Can You Rework Circuits Under a BGA?
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