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Tech Papers
Tech papers include white papers and case studies with the latest technical and scientific research covering the field of electronics assembly.

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Analysis of Voiding Under QFN Packages
Paper covers results of experiments on QFN devices when the ensuing voiding level was calculated by x-ray inspection.
Head-On-Pillow Defect - A Pain in the Neck
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with.
Fighting Counterfeit Electronic Products
Author provides a framework for analysis of the choices brand-owners must make, to protect their brands from counterfeiting activities.
Poor Metrology: The Hidden Cost
Paper compares and contrasts acquiring a Cpk value from an external metrology system versus one from an internal system.
Reliability of Coated WLCSP Components
Paper evaluates coating adhesion and solder joint reliability for assemblies with different conformal coatings, solder masks and underfill.

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Index
Analysis of Voiding Under QFN Packages
Head-On-Pillow Defect - A Pain in the Neck
Fighting Counterfeit Electronic Products
Poor Metrology: The Hidden Cost
Reliability of Coated WLCSP Components
Assembly of Fine Pitch PoP Components
Stencil Design Improves Drop Test Performance
Design for Assembly of 01005 Components
Fighting Undesirable Effects of Thermal Cycling
Design for Low-Halogen Green Electronics
Qualification of Thin Form Factor PWBs
Effect of Clamping Systems on Print Quality
Reliability Assessment of Reballed BGAs
Assembly and Reliability Investigation of PoP
Relationship Between Via Size and Cleanliness
Reliability of Multiple Pb-free Solder Ball Alloys
Why Switch From Pure DI-Water to Chemistry
Hand Sanitizers and Risks to Electronics
Gold Stud Bump Flip Chip Attachment
Embedded Packaging Technologies
Pb-Free Alloy Alternatives
Addressing Head-In-Pillow Defects
Effect of Soldering and Flux on Whisker Growth
Effects of Solder Mask on Electro-Migration
RoHS - Changing Products to Conform
Enhancing Reliability of PB-Free Solder Joints
Copper Dissolution in Lead-Free Alloys
Lead Free Reflow and Influence of Moisture
Embedded Passives Become Mainstream
Thermal Cycle Testing of PWBs
Selective Surface Mount Soldering Options
SMT Process Characterization
Dip Solder Paste for BGA Rework
Does Contamination Effect Whisker Formation?
Developing a New Lead-Free Alloy
Solder Bumping for Flip Chip Technology
The Proliferation of Lead Free Alloys
Void Detection in Solder Balls/Joints
Broadband Printing Challenges
A New PCB Surface Finish
Printable Materials for Electronic Packaging
Solder Paste Ingredients vs. Performance
Conformal Coating for Tin Whisker Management
Transition of Production Between Sites
Overcoming Repair Depot Challenges
Head and Pillow SMT Failure Modes
Industry United to Fight Counterfeiting
Advances in Monitoring of Stencil Printing
Nanotechnology for Lead-Free Final Finishes
Imbedded Components: Ready for Mainstream?
Solder Creep Fatigue for Lead-Free Joints
Cleanliness of Stencils and Misprinted Boards
False Tin Whiskers: Masquerading Intermetallic
Limitations of DI-Water Cleaning Processes
A Robust Fine Feature Printing Process
PCB Assembly System Set-Up for PoP
Best Practices - Reflow Profiling for Lead Free
The Universal PCB Design Grid System
Does Copper Dissolution Impact Reliability?
OA Flux Cleaning Studies on Dense Packages
Optimizing Print Process for Mixed Technology
Selecting Cleaning Processes for Defluxing
Implementation & Reliability of Lead Free Solder
Inkjet Printing for Electronic Circuits
Effects of Reflow and Flux on Tin Whiskers
Lead-Free Flux and Influence on Cleaning
Solder Paste Residue Corrosivity Assessment
Real or Fake? The Counterfeit Chip Conundrum
Bridging Supply Chain Gap for Exempt OEMs
Hot Air Solder Leveling in the Lead-free Era
Stencil Printing for Miniaturized Electronics
RoHS War Stories
Estimating Stencil Life
Effect of Lead-Free on Key Material Properties
Design for Flip-Chip and Chip-Size Technology
3 Steps To Solder Paste Selection
Step Stencil Design for Handheld
Pockets of Contamination
Predictability for PCB Layout Density
Nitrogen Effect For Wave Soldering
The Digital Solder Paste
Cleaning Assemblies in Batch Systems
Reliability & Failure Mechanisms of Substrates
Preparing Supply Chains for Green Transitions
Implementing Halogen-Free PCB Assembly
Long Term Reliability Analysis of Lead Free
Bare Board Performance after Pb-Free Reflow
Thermal Shock/Drop Test of Lead Free
Qualification of PWBs Outsourced from Asia
Reliability of Sn/Cu/Ni Solder Joints
Rework for Lead-Free Mirrored BGA Designs
When Precision is Not Good Enough
Collaborative Cleaning Process Innovations
Reinroduction of Vapor Phase Soldering
Challenges of Package on Package Devices
Lead Free Development in Server Applications
PCB Layout and Soldering Nozzle Design
Dross Elimination and Prevention
Improve Etching Performance
TOP Doing More With Less
Solving Test Challenges: Razor Sharp Probes
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